您好,我是琳宇,欢迎来到我的个人网站。
Hi, I'm Linyu. Welcome to my personal site.
我在湖南大学,上海交通大学分别取得电子科学与技术工学学士和硕士学位, 目前是一名研究人员, 如果您是HR, 投资人,或是对我的文章或者项目感兴趣,欢迎联系我。
I received my B.S. and M.S. in ECE from the Hunan University and Shanghai Jiao Tong University. Currently I am a researcher. If you are HR, investor or interested in my projects, welcom to contact me.
1 AI for EDA
1.1 AI accelerates Multi-corner Wire Timing Signoff
Some of this project has been published in ICCAD24 and AICAS23.
🔗 GitHub Code
1.2 Physical-aware Logic Synthesis
Some of this project has been published in ICCD23.
🔗 GitHub Code
1.3 Multi-bitflip-flops clustering with wire timing prediction
Some of this project has been published in ASP-DAC25.
🔗 GitHub Code
1.4 Elastic eda: Auto-scaling cloud resources for eda tasks via learning-based approaches
Some of this project has been published in ICCD24.
🔗 GitHub Code
2. Advanced Design
2.1 TempestCache: Adaptive Cache Intelligence for the Modern Data Storm
This design is ongoing, now is on functional verification.
🔗 GitHub Code
2.2 RISC-V CPU design with the fusion of front and back-end
2.3 RISC-V CPU design with the fusion of front and back-end
2.4 Physically aware AI accelerator SoC Design
3. Design Flow Dataset
3.1 CircuitS2L: Circuit Dataset Augmentation Framework by Generative Featuring and Supervised Labeling
Some of this project is submitted to ICCAD25.
🔗 GitHub Code
3.2 7nm, 14nm, 28nm, 45nm EDA Design FLow Dataset
I have collected some dataset for AI4EDA tasks.
🔗 GitHub Code
Recent Publications
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Extending silicon lifetime: A review of design
techniques for reliable integrated circuits
2025. arXiv: 2503.21165
Book
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AI-Enabled Electronic Circuit and System Design
Springer,2025
Book
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Learning-based Predictions for EDA Shift-left Paradigm
2025 30th Asia and South Pacific Design Automation Conference (ASP-DAC), 2025
Poster
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Revisit mbff: Efficient early-stage multi-bit flip-flops clustering with physical and timing awareness
2025 30th Asia and South Pacific Design Automation Conference (ASP-DAC), 2025
Paper
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One-for-all: An unified learning-based framework for efficient cross-corner timing signoff
2024 IEEE/ACM International Conference on Computer Aided Design (ICCAD), 2024
Paper
, Slide
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Elastic eda: Auto-scaling cloud resources for eda tasks via learning-based approaches
2024 IEEE 42st International Conference on Computer Design (ICCD), 2024
Paper
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Integration of shift-left updates into logic synthesis and macro placement
Conference of Science and Technology for Integrated Circuits (CSTIC), 2024
Paper
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Delay-driven physically-aware logic synthesis with informed search
IEEE 41st International Conference on Computer Design (ICCD), 2023
Paper
Code
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Rc-gnn: Fast and accurate signoff wire delay estimation with customized graph neural networks
IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2023
Paper
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Delay-driven physical-aware logic synthesis with reinforcement learning
2023 CCF 4th Integrated Circuit Design and Automation Conference (CCF-DAC), 2023
Paper
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A Promising Way of Energy Harvesting for Implantable Medical Devices – Thermoelectric Generator (TEG)
International Conference on Smart City and Green Energy (ICSCGE), 2021
Paper
Patent
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Signoff-level timing prediction methods and systems across process corners
ZL202311787034.5
Link
Contact
📧 linyuzhu@sjtu.edu.cn | 💻 GitHub: Linyu-Zhu