您好,我是琳宇,欢迎来到我的个人网站。 Hi, I'm Linyu. Welcome to my personal site.

我在湖南大学,上海交通大学分别取得电子科学与技术工学学士和硕士学位, 目前是一名研究人员, 如果您是HR, 投资人,或是对我的文章或者项目感兴趣,欢迎联系我。 I received my B.S. and M.S. in ECE from the Hunan University and Shanghai Jiao Tong University. Currently I am a researcher. If you are HR, investor or interested in my projects, welcom to contact me.

1 AI for EDA

1.1 AI accelerates Multi-corner Wire Timing Signoff

项目预览图

Some of this project has been published in ICCAD24 and AICAS23.

🔗 GitHub Code

1.2 Physical-aware Logic Synthesis

项目预览图

Some of this project has been published in ICCD23.

🔗 GitHub Code

1.3 Multi-bitflip-flops clustering with wire timing prediction

项目预览图

Some of this project has been published in ASP-DAC25.

🔗 GitHub Code

1.4 Elastic eda: Auto-scaling cloud resources for eda tasks via learning-based approaches

项目预览图

Some of this project has been published in ICCD24.

🔗 GitHub Code

2. Advanced Design

2.1 TempestCache: Adaptive Cache Intelligence for the Modern Data Storm

项目预览图

This design is ongoing, now is on functional verification.

🔗 GitHub Code

2.2 RISC-V CPU design with the fusion of front and back-end

2.3 RISC-V CPU design with the fusion of front and back-end

2.4 Physically aware AI accelerator SoC Design

3. Design Flow Dataset

3.1 CircuitS2L: Circuit Dataset Augmentation Framework by Generative Featuring and Supervised Labeling

项目预览图

Some of this project is submitted to ICCAD25.

🔗 GitHub Code

3.2 7nm, 14nm, 28nm, 45nm EDA Design FLow Dataset

项目预览图

I have collected some dataset for AI4EDA tasks.

🔗 GitHub Code

Recent Publications

  • Extending silicon lifetime: A review of design techniques for reliable integrated circuits
    2025. arXiv: 2503.21165
    Book
  • AI-Enabled Electronic Circuit and System Design
    Springer,2025
    Book
  • Learning-based Predictions for EDA Shift-left Paradigm
    2025 30th Asia and South Pacific Design Automation Conference (ASP-DAC), 2025
    Poster
  • Revisit mbff: Efficient early-stage multi-bit flip-flops clustering with physical and timing awareness
    2025 30th Asia and South Pacific Design Automation Conference (ASP-DAC), 2025
    Paper
  • One-for-all: An unified learning-based framework for efficient cross-corner timing signoff
    2024 IEEE/ACM International Conference on Computer Aided Design (ICCAD), 2024
    Paper , Slide
  • Elastic eda: Auto-scaling cloud resources for eda tasks via learning-based approaches
    2024 IEEE 42st International Conference on Computer Design (ICCD), 2024
    Paper
  • Integration of shift-left updates into logic synthesis and macro placement
    Conference of Science and Technology for Integrated Circuits (CSTIC), 2024
    Paper
  • Delay-driven physically-aware logic synthesis with informed search
    IEEE 41st International Conference on Computer Design (ICCD), 2023
    Paper Code
  • Rc-gnn: Fast and accurate signoff wire delay estimation with customized graph neural networks
    IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2023
    Paper
  • Delay-driven physical-aware logic synthesis with reinforcement learning
    2023 CCF 4th Integrated Circuit Design and Automation Conference (CCF-DAC), 2023
    Paper
  • A Promising Way of Energy Harvesting for Implantable Medical Devices – Thermoelectric Generator (TEG)
    International Conference on Smart City and Green Energy (ICSCGE), 2021
    Paper

Patent

  • Signoff-level timing prediction methods and systems across process corners
    ZL202311787034.5
    Link

Contact

📧 linyuzhu@sjtu.edu.cn | 💻 GitHub: Linyu-Zhu